Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10150898 | Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in high density printheads | Yanjia Zuo, Mandakini Kanungo, Hong Zhao, John R. Andrews, Pratima Gattu Naga Rao +1 more | 2018-12-11 |
| 10052874 | B-stage film adhesive compatible with aqueous ink for printhead structures interstitial bonding in high density piezo printheads fabrication for aqueous inkjet | Yanjia Zuo, Mandakini Kanungo, Hong Zhao, Pratima Gattu Naga Rao, Santokh S. Badesha +1 more | 2018-08-21 |
| 9931843 | Raised fluid pass-through structure in print heads | Jonathan Robert Brick, Chad David Freitag, Garry Adam Jones, Jon G. Judge, David R. Koehler +3 more | 2018-04-03 |
| 9890306 | Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in in high density printheads | Yanjia Zuo, Mandakini Kanungo, Hong Zhao, John R. Andrews, Pratima Gattu Naga Rao +1 more | 2018-02-13 |