Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10150898 | Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in high density printheads | Yanjia Zuo, Mandakini Kanungo, Hong Zhao, John R. Andrews, Mark A. Cellura +1 more | 2018-12-11 |
| 10052874 | B-stage film adhesive compatible with aqueous ink for printhead structures interstitial bonding in high density piezo printheads fabrication for aqueous inkjet | Yanjia Zuo, Mandakini Kanungo, Hong Zhao, Mark A. Cellura, Santokh S. Badesha +1 more | 2018-08-21 |
| 9890306 | Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in in high density printheads | Yanjia Zuo, Mandakini Kanungo, Hong Zhao, John R. Andrews, Mark A. Cellura +1 more | 2018-02-13 |