KK

Kuiwon Kang

QU Qualcomm: 1 patents #1,178 of 2,752Top 45%
📍 San Diego, CA: #1,790 of 4,341 inventorsTop 45%
🗺 California: #23,431 of 60,411 inventorsTop 40%
Overall (2018): #336,773 of 503,207Top 70%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10157824 Integrated circuit (IC) package and package substrate comprising stacked vias Houssam Jomaa, Layal Rouhana, Seongryul Choi 2018-12-18