Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141623 | Multi-layer printed circuit board having first and second coaxial vias coupled to a core of a dielectric waveguide disposed in the circuit board | Samuel R. Connor, Jose A. Hejase, Joseph Kuczynski, Joshua C. Myers | 2018-11-27 |