Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121734 | Semiconductor device | Tzung-Han Lee, Yaw Wen Hu, Neng-Tai Shih, Hsin-Chuan Tsai, Sheng-Hsiung Wu | 2018-11-06 |
| 9916999 | Methods of fabricating a semiconductor package structure including at least one redistribution layer | Shing-Yih Shih, Neng-Tai Shih | 2018-03-13 |