Issued Patents 2018
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10153161 | Method for manufacturing a semiconductor structure | — | 2018-12-11 |
| 10147611 | Method for preparing semiconductor structures | Cheng-Wei Wang, Tzu-Li TSENG | 2018-12-04 |
| 10147608 | Method for preparing a patterned target layer | Chih-Wei Cheng, Ming Ko | 2018-12-04 |
| 10128212 | Semiconductor package and fabrication method thereof | Tieh-Chiang Wu | 2018-11-13 |
| 10121849 | Methods of fabricating a semiconductor structure | Tieh-Chiang Wu | 2018-11-06 |
| 10115594 | Method of forming fine island patterns of semiconductor devices | Chiang-Lin Shih, Chih-Ching Lin | 2018-10-30 |
| 10090154 | Method for preparing a semiconductor structure having second line patterns and third line patterns formed over first line patterns | Jeng-Ping Lin, Chiang-Lin Shih | 2018-10-02 |
| 10056338 | Methods of forming semiconductor packages including molding semiconductor chips of the semiconductor packages | Tieh-Chiang Wu | 2018-08-21 |
| 10049877 | Patterning method | — | 2018-08-14 |
| 10043769 | Semiconductor devices including dummy chips | Neng-Tai Shih | 2018-08-07 |
| 10026680 | Semiconductor package and fabrication method thereof | — | 2018-07-17 |
| 10008461 | Semiconductor structure having a patterned surface structure and semiconductor chips including such structures | Tieh-Chiang Wu | 2018-06-26 |
| 9922924 | Interposer and semiconductor package | — | 2018-03-20 |
| 9922845 | Semiconductor package and fabrication method thereof | — | 2018-03-20 |
| 9916999 | Methods of fabricating a semiconductor package structure including at least one redistribution layer | Hsu Chiang, Neng-Tai Shih | 2018-03-13 |