HS

HanGil Shin

SC Stats Chippac: 2 patents #13 of 69Top 20%
Overall (2018): #145,838 of 503,207Top 30%
2
Patents 2018

Issued Patents 2018

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9966335 Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die NamJu Cho, HeeJo Chi 2018-05-08
9865575 Methods of forming conductive and insulating layers HeeJo Chi, KyungMoon Kim 2018-01-09