Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10015882 | Modular semiconductor package | Binh K. Le, Michael Arnold, Walid M. Meliane | 2018-07-03 |
| 9911678 | Substrate with integrated heat spreader | — | 2018-03-06 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10015882 | Modular semiconductor package | Binh K. Le, Michael Arnold, Walid M. Meliane | 2018-07-03 |
| 9911678 | Substrate with integrated heat spreader | — | 2018-03-06 |