Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10015882 | Modular semiconductor package | Dylan Murdock, Binh K. Le, Michael Arnold | 2018-07-03 |
| 9991181 | Air-cavity package with enhanced package integration level and thermal performance | Kevin J. Anderson, Tarak A. Railkar | 2018-06-05 |
| 9974158 | Air-cavity package with two heat dissipation interfaces | Tarak A. Railkar, Kevin J. Anderson | 2018-05-15 |