Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163746 | Semiconductor package with improved signal stability and method of manufacturing the same | Jong In Ryu, Ki Joo Sim, Ki-ju Lee, Jin Su Kim | 2018-12-25 |
| 10109595 | Double-sided package module and substrate strip | Hee Jung Jung, Jong In Ryu, Ki Joo Sim | 2018-10-23 |
| 9894790 | Electronic component module and manufacturing method thereof | Eun Jung Jo, Jae Hyun Lim | 2018-02-13 |