Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163746 | Semiconductor package with improved signal stability and method of manufacturing the same | Ki Joo Sim, Do Jae Yoo, Ki-ju Lee, Jin Su Kim | 2018-12-25 |
| 10109595 | Double-sided package module and substrate strip | Do Jae Yoo, Hee Jung Jung, Ki Joo Sim | 2018-10-23 |
| 9997504 | Electronic device module and method of manufacturing the same | Jae Hyun Lim, Sung Ho Kim, Jin Su Kim | 2018-06-12 |
| 9868274 | Electronic device and method of fabricating exterior member for the same | Myung-Gon Kim, Min-Su Chang | 2018-01-16 |