Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9922955 | Semiconductor device and method of forming package-on-package structure electrically interconnected through TSV in WLCSP | Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2018-03-20 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9922955 | Semiconductor device and method of forming package-on-package structure electrically interconnected through TSV in WLCSP | Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2018-03-20 |