Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10153221 | Face down dual sided chip scale memory package | Akshay N. Singh, Yi Xu, Liana Foster, Steven Eskildsen | 2018-12-11 |
| 10103038 | Thrumold post package with reverse build up hybrid additive structure | John F. Kaeding, Ashok Pachamuthu, Mark E. Tuttle | 2018-10-16 |
| 9978730 | Method of assembly semiconductor device with through-package interconnect | Todd O. Bolken | 2018-05-22 |