JK

John F. Kaeding

Micron: 1 patents #397 of 951Top 45%
📍 Boise, ID: #203 of 458 inventorsTop 45%
🗺 Idaho: #331 of 939 inventorsTop 40%
Overall (2018): #364,066 of 503,207Top 75%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10103038 Thrumold post package with reverse build up hybrid additive structure Chan H. Yoo, Ashok Pachamuthu, Mark E. Tuttle 2018-10-16