Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10009001 | Devices with specific termination angles in titanium tungsten layers and methods for fabricating the same | Neng Jiang, Maciej Blasiak, Nicholas Stephen Dellas | 2018-06-26 |
| 10009008 | Bulk acoustic wave (BAW) device having roughened bottom side | Stuart M. Jacobsen | 2018-06-26 |
| 9896330 | Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Karen Hildegard Ralston Kirmse, Benjamin Stassen Cook +2 more | 2018-02-20 |