Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10009008 | Bulk acoustic wave (BAW) device having roughened bottom side | Brian E. Goodlin | 2018-06-26 |
| 9929714 | Temperature compensated bulk acoustic wave resonator with a high coupling coefficient | Rick L. Wise, Maria Wang, Ricky Alan Jackson, Nicholas Stephen Dellas, Django Trombley | 2018-03-27 |
| 9910015 | Sensor array chip with piezoelectric transducer including inkjet forming method | — | 2018-03-06 |
| 9896330 | Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse +2 more | 2018-02-20 |