Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10067416 | Ebeam three beam aperture array | Yan Borodovsky, Mark C. Phillips | 2018-09-04 |
| 10068874 | Method for direct integration of memory die to logic die without use of thru silicon vias (TSV) | M Clair Webb, Patrick Morrow, Kimin Jun | 2018-09-04 |
| 10014256 | Unidirectional metal on layer with ebeam | Yan Borodovsky, Mark C. Phillips | 2018-07-03 |
| 9952511 | Ebeam non-universal cutter | Yan Borodovsky, Mark C. Phillips | 2018-04-24 |
| 9897908 | Ebeam three beam aperture array | Yan Borodovsky, Mark C. Phillips | 2018-02-20 |