Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9972535 | Method of separating semiconductor dies from a semiconductor substrate, semiconductor substrate assembly and semiconductor die assembly | Franco Mariani | 2018-05-15 |
| 9911655 | Method of dicing a wafer and semiconductor chip | Bernhard Drummer, Korbinian Kaspar, Gunther Mackh | 2018-03-06 |