Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10029913 | Removal of a reinforcement ring from a wafer | Adolf Koller | 2018-07-24 |
| 9911655 | Method of dicing a wafer and semiconductor chip | Markus Brunnbauer, Korbinian Kaspar, Gunther Mackh | 2018-03-06 |