Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121751 | Integrated antennas in wafer level package | Rudolf Lachner, Linus Maurer | 2018-11-06 |
| 9922946 | Method of manufacturing a semiconductor package having a semiconductor chip and a microwave component | Ernst Seler, Walter Hartner, Josef Boeck | 2018-03-20 |
| 9910145 | Wireless communication system, a radar system and a method for determining a position information of an object | Josef Boeck, Rudolf Lachner, Walter Hartner | 2018-03-06 |