Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10037900 | Underfill stop using via bars in semiconductor packages | Jorn Isaksen, Shamsuddin Ahmed, Ralf Reuter | 2018-07-31 |
| 9922946 | Method of manufacturing a semiconductor package having a semiconductor chip and a microwave component | Maciej Wojnowski, Walter Hartner, Josef Boeck | 2018-03-20 |