Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10099411 | Method and apparatus for simultaneously encapsulating semiconductor dies with layered lead frame strips | Choon Huey Wang, Chau Fatt Chiang, Swee Kah Lee | 2018-10-16 |
CF
Chee Hong Fang
Overall (2018): #462,121 of 503,207Top 95%
1
Patents 2018