Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134649 | Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring | Taryn J. Davis, Jonathan Fry | 2018-11-20 |
| 10068812 | Method and structure for flip-chip package reliability monitoring using capacitive sensors groups | Taryn J. Davis, Jonathan Fry | 2018-09-04 |
| 10008427 | Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring | Taryn J. Davis, Jonathan Fry | 2018-06-26 |
| 9911716 | Polygon die packaging | Taryn J. Davis | 2018-03-06 |