Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134649 | Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring | Jonathan Fry, Tuhin Sinha | 2018-11-20 |
| 10068812 | Method and structure for flip-chip package reliability monitoring using capacitive sensors groups | Jonathan Fry, Tuhin Sinha | 2018-09-04 |
| 10032683 | Time temperature monitoring system | Jonathan Fry, Terence L. Kane, Christopher F. Klabes, Andrew J. Martin, Vincent J. McGahay +2 more | 2018-07-24 |
| 10008427 | Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring | Jonathan Fry, Tuhin Sinha | 2018-06-26 |
| 9911716 | Polygon die packaging | Tuhin Sinha | 2018-03-06 |