Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163697 | Method for forming BEOL metal levels with multiple dielectric layers for improved dielectric to metal adhesion | Felix P. Anderson, Michael S. Dusablon, David C. Mosher | 2018-12-25 |
| 10141274 | Semiconductor chip with anti-reverse engineering function | Fen Chen, Jonathan M. Pratt, Jason P. Ritter, Patrick S. Spinney, Anna Tilley | 2018-11-27 |
| 10056306 | Test structure for monitoring interface delamination | Gary L. Milo, Thomas Warren Weeks, Jr., Patrick S. Spinney, John C. S. Hall, Brian P. Conchieri +2 more | 2018-08-21 |
| 9893023 | Semiconductor chip with anti-reverse engineering function | Fen Chen, Jonathan M. Pratt, Jason P. Ritter, Patrick S. Spinney, Anna Tilley | 2018-02-13 |