Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10062631 | Power module | Young Seok Kim, Hyun Woo Noh, Kyoung-Kook Hong | 2018-08-28 |
| 9972597 | Method of bonding with silver paste | Kyoung-Kook Hong, Hyun Woo Noh, Youngkyun Jung, Dae Hwan Chun, Jong Seok Lee | 2018-05-15 |