Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10062631 | Power module | Young Seok Kim, Hyun Woo Noh, Su Bin Kang | 2018-08-28 |
| 9972597 | Method of bonding with silver paste | Hyun Woo Noh, Youngkyun Jung, Dae Hwan Chun, Jong Seok Lee, Su Bin Kang | 2018-05-15 |
| 9887286 | Semiconductor device having low impedance and method of manufacturing the same | Dae Hwan Chun, Jong Seok Lee, Junghee Park, Youngkyun Jung | 2018-02-06 |