Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109569 | Via structure and circuit board having the via structure | Weiyi Feng, Weiqiang Zhang, Hongyang Wu, Ziying Zhou | 2018-10-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109569 | Via structure and circuit board having the via structure | Weiyi Feng, Weiqiang Zhang, Hongyang Wu, Ziying Zhou | 2018-10-23 |