Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109569 | Via structure and circuit board having the via structure | Yuechao Li, Weiyi Feng, Weiqiang Zhang, Hongyang Wu | 2018-10-23 |
| 10073506 | Method and system for testing circuit | Jianhong Zeng, Haoyi Ye, Peiqing Hu | 2018-09-11 |