Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10083920 | Package stiffener for protecting semiconductor die | William Frank Edwards, Erick Tuttle, Madhusudan K. Iyengar, Yuan Li, Jorge Padilla +1 more | 2018-09-25 |
| 10032696 | Chip package using interposer substrate with through-silicon vias | — | 2018-07-24 |
| 10025047 | Integration of silicon photonics IC for high data rate | Hong Liu, Ryohei Urata, Woon-Seong Kwon | 2018-07-17 |