Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10083920 | Package stiffener for protecting semiconductor die | Erick Tuttle, Madhusudan K. Iyengar, Yuan Li, Jorge Padilla, Woon-Seong Kwon +1 more | 2018-09-25 |
| 9881725 | Ethernet magnetics package wire terminations | Ki-Yuen Chau, Keith Frank Tharp, George Edward Curtis, Kayen Lin | 2018-01-30 |