Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10068795 | Methods for preparing layered semiconductor structures | Michael J. Ries, Charles R. Lottes | 2018-09-04 |
| 9925755 | Clamping apparatus for cleaving a bonded wafer structure and methods for cleaving | Gregory Young | 2018-03-27 |