Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9859177 | Test method and structure for integrated circuits before complete metalization | Janakiraman Viraraghavan, Balaji Jayaraman, Thejas Kempanna, Rajesh Reddy Tummuru, Toshiaki Kirihata | 2018-01-02 |