Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D825499 | Light emitting diode package | Chuan-Yu Liu, Chun-Ming Tseng, Yu-Jung Wu, Yu-Feng Lin | 2018-08-14 |
| 9953956 | Package substrate and package structure using the same | Hao-Chung Lee, Yu-Feng Lin | 2018-04-24 |