Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147709 | Light emitting module | Yu-Feng Lin | 2018-12-04 |
| 10090445 | Package method and package | Chin-Hua Hung, Yu-Feng Lin | 2018-10-02 |
| 10064272 | Light emitting device using metal substrate for improving heat dissipation efficiency | Yu-Feng Lin, Meng-Ting Tsai | 2018-08-28 |
| 9997676 | Light emitting device and manufacturing method thereof | Cheng-Wei Hung, Chin-Hua Hung, Long-Chi Du, Jui-Fu Chang, Po-Tsun Kuo +1 more | 2018-06-12 |
| 9953956 | Package substrate and package structure using the same | Yu-Feng Lin, Xun-Xain Zhan | 2018-04-24 |