Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10079360 | Resin composition for sealing electronic devices, and electronic device | Tetsuya Mieda, Yasushi Ishizaka, Keiji Saito | 2018-09-18 |
| 10043996 | Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display device | Masami Aoyama, Tetsuya Mieda, Keiji Saito, Kunihiko ISHIGURO, Toshimitsu Nakamura +1 more | 2018-08-07 |