Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115707 | Adhesive film and semiconductor package using adhesive film | Noriyuki Kirikae | 2018-10-30 |
| 10043996 | Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display device | Tetsuya Mieda, Keiji Saito, Kunihiko ISHIGURO, Toshimitsu Nakamura, Naoaki Mihara +1 more | 2018-08-07 |