Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074608 | Method for manufacturing a contact bump by thermal expansion of a patterned sacrificial layer underneath a galvanic layer | Martin Wilke, Kai Zoschke, Thomas Fritzsch, Hermann Oppermann, Oswin Ehrmann | 2018-09-11 |