Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134707 | Bonding method for connecting two wafers | Michael Töpper | 2018-11-20 |
| 10074608 | Method for manufacturing a contact bump by thermal expansion of a patterned sacrificial layer underneath a galvanic layer | Martin Wilke, Markus Wöhrmann, Thomas Fritzsch, Hermann Oppermann, Oswin Ehrmann | 2018-09-11 |
| 9917070 | Method for arranging electronic switching elements, electronic switching arrangement and use of a carrier having a bonding layer | Hans-Hermann Oppermann, Lena Goullon | 2018-03-13 |