Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049949 | In-situ packaging decapsulation feature for electrical fault localization | Tameyasu Anayama, Herve Deslandes | 2018-08-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049949 | In-situ packaging decapsulation feature for electrical fault localization | Tameyasu Anayama, Herve Deslandes | 2018-08-14 |