Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049949 | In-situ packaging decapsulation feature for electrical fault localization | Tameyasu Anayama, John Muzzio | 2018-08-14 |
| 10041997 | System and method for fault isolation by emission spectra analysis | Prasad Sabbineni, Regina Freed | 2018-08-07 |
| 9903824 | Spectral mapping of photo emission | Antoine Reverdy, Thierry Parrassin | 2018-02-27 |