Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163646 | Method for forming semiconductor device structure | Keng-Ying Liao, Chung-Bin Tseng, Po-Zen Chen, Yi-Jie Chen | 2018-12-25 |
| 10141362 | Semiconductor device having protection layer wrapping around conductive structure | Chih-Wei Sung, Keng-Ying Liao, Yi Yang, Chih-Yu Wu | 2018-11-27 |
| 10104205 | Flexible data packet information mapping and modification | Chun-Kai Huang, Cheng-Ying Yu | 2018-10-16 |
| 10050187 | Light-emitting device and manufacturing method of light-emitting device | Yung-Jung Liang | 2018-08-14 |
| 10037293 | Wafer-level package having asynchronous FIFO buffer used to deal with data transfer between different dies and associated method | Yuan Liu | 2018-07-31 |
| 10008530 | Image sensing device and manufacturing method thereof | Keng-Ying Liao, Chung-Bin Tseng, Cheng-Hsien Chou, Jiech-Fun Lu, Po-Zen Chen | 2018-06-26 |
| 9929203 | Semiconductor device and method for fabricating thereof | Chih-Wei Sung, Keng-Ying Liao, Yi Yang, Chih-Yu Wu | 2018-03-27 |