WW

Wei-Chung Wang

CC China Wafer Level Csp Co.: 5 patents #1 of 3Top 35%
NU National Tsing Hua University: 4 patents #3 of 213Top 2%
AM Amazon: 1 patents #1,289 of 3,429Top 40%
II Institute For Information Industry: 1 patents #11 of 86Top 15%
NL National Applied Research Laboratories: 1 patents #7 of 65Top 15%
Microsoft: 1 patents #1,765 of 6,275Top 30%
Overall (2018): #3,484 of 503,207Top 1%
13
Patents 2018

Issued Patents 2018

Patent #TitleCo-InventorsDate
10133907 Fingerprint recognition chip packaging structure and packaging method Zhiqi Wang, Qiong Yu 2018-11-20
10126151 Wafer-level chip package structure and packaging method Zhiqi Wang, Qiong Yu 2018-11-13
10108837 Fingerprint recognition chip packaging structure and packaging method Zhiqi Wang, Qiong Yu 2018-10-23
10096643 Fingerprint recognition chip packaging structure and packaging method Zhiqi Wang, Qiong Yu 2018-10-09
10090217 Chip packaging method and package structure Zhiqi Wang, Qiong Yu 2018-10-02
10075237 Visible light communication system and method Hsiang-Chain Hsieh, Chi-Wai Chow, Yen-Ting Chen, Chia-Wei Chen 2018-09-11
10067012 Stress measurement method and system for optical materials Po-Chi Sung, Zheng Lu, Yu-Liang YEH, Po-Yu Chen 2018-09-04
10036677 Method for analyzing stress in an object Po-Chi Sung, Yu-An Chiang, Te Heng Hung 2018-07-31
10013388 Dynamic peer-to-peer configuration 2018-07-03
10006761 Method and system for on-line real-time measuring the surface topography and out-of plane deformation by using phase-shifting shadow moiré method Wen-Yi Kang, Ya-Hsin Chang, Hsuan-Hao Hsu 2018-06-26
9952034 Optical interferometric system for measurement of a full-field thickness of a plate-like object in real time Po-Chi Sung 2018-04-24
9883115 Method of determining whole-scene image by using multiple image-capturing devices Chi-Hung Huang, Yung-Hsiang Chen 2018-01-30
D806669 Handset Heikki Kangasmaa, Tomi Suoniemi, Mikko Vesa, Mikko Pesonen 2018-01-02