Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10133907 | Fingerprint recognition chip packaging structure and packaging method | Zhiqi Wang, Wei-Chung Wang | 2018-11-20 |
| 10126151 | Wafer-level chip package structure and packaging method | Zhiqi Wang, Wei-Chung Wang | 2018-11-13 |
| 10108837 | Fingerprint recognition chip packaging structure and packaging method | Zhiqi Wang, Wei-Chung Wang | 2018-10-23 |
| 10096643 | Fingerprint recognition chip packaging structure and packaging method | Zhiqi Wang, Wei-Chung Wang | 2018-10-09 |
| 10090217 | Chip packaging method and package structure | Zhiqi Wang, Wei-Chung Wang | 2018-10-02 |