HP

Hyun Hang Park

CC Corning Precision Materials Co.: 1 patents #26 of 60Top 45%
Overall (2018): #391,330 of 503,207Top 80%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10026683 Integrated circuit package substrate Bo Gyeong Kim, Hyun-Bin Kim, Sung Hoon Lee 2018-07-17