Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10026683 | Integrated circuit package substrate | Hyun Hang Park, Hyun-Bin Kim, Sung Hoon Lee | 2018-07-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10026683 | Integrated circuit package substrate | Hyun Hang Park, Hyun-Bin Kim, Sung Hoon Lee | 2018-07-17 |