Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134657 | Inorganic wafer having through-holes attached to semiconductor wafer | Garrett Andrew Piech, Aric Bruce Shorey | 2018-11-20 |
| 10077206 | Methods of etching glass substrates and glass substrates | Thomas M. Castle, Tian Huang, Yuhui Jin, Tammy Lynn Petriwsky | 2018-09-18 |