Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134657 | Inorganic wafer having through-holes attached to semiconductor wafer | Daniel Wayne Levesque, JR., Garrett Andrew Piech | 2018-11-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134657 | Inorganic wafer having through-holes attached to semiconductor wafer | Daniel Wayne Levesque, JR., Garrett Andrew Piech | 2018-11-20 |