Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115698 | Method for direct adhesion via low-roughness metal layers | Paul GONDCHARTON, Bruno Imbert | 2018-10-30 |
| 10032742 | Method for obtaining a bonding surface for direct bonding | Paul GONDCHARTON, Bruno Imbert | 2018-07-24 |
| 9997394 | Method for transferring a thin layer with supply of heat energy to a fragile zone via an inductive layer | Thomas Signamarcheix, Emmanuel Augendre | 2018-06-12 |
| 9981420 | Sensor capable of sensing pressure by means of the deformation of a wrinkled piezoelectric layer | Jean-Sebastien Moulet | 2018-05-29 |
| 9922953 | Process for producing a structure by assembling at least two elements by direct adhesive bonding | Paul GONDCHARTON, Bruno Imbert, Hubert Moriceau | 2018-03-20 |