BI

Bruno Imbert

CEA: 4 patents #21 of 909Top 3%
SO Soitec: 1 patents #9 of 46Top 20%
Overall (2018): #48,291 of 503,207Top 10%
4
Patents 2018

Issued Patents 2018

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
10115698 Method for direct adhesion via low-roughness metal layers Paul GONDCHARTON, Lamine Benaissa 2018-10-30
10032742 Method for obtaining a bonding surface for direct bonding Lamine Benaissa, Paul GONDCHARTON 2018-07-24
9991439 Method for implanting a piezoelectric material Chrystel Deguet, Nicolas Blanc, Jean-Sebastien Moulet 2018-06-05
9922953 Process for producing a structure by assembling at least two elements by direct adhesive bonding Paul GONDCHARTON, Lamine Benaissa, Hubert Moriceau 2018-03-20